With smartphone SoCs getting more and more powerful, it does not come as a surprise that manufacturers are looking for a way to keep them as cool as possible, and Samsung might use heatpipes for its upcoming Galaxy S7 smartphone.

According to a report from Chinese site UDN, Samsung is currently looking for heatpipe suppliers which suggest that the upcoming Galaxy S7 might be the first Samsung smartphone to use such cooling solution.

Sony already used a similar solution on its Xperia Z5 smartphone and Microsoft is using a similar cooling system on the Lumia 950 XL smartphone. Qualcomm's Snapdragon 810 had heating issues and it appears that Samsung does not want the same issue with its next-generation flagship smartphones.

According to the same report, Samsung is looking for a heatpipe solution which is just 0.6mm thick. Recently Fujitsu unveiled its newest solution which uses six 0.1mm heatpipes, stacked together, so this might be the one that Samsung will use.

Using a more advanced cooling system might raise the weight of a device and leave less room for other components but it will at least stop the smartphone from overheating and prevent thermal throttling.



Source: Kitguru.net.