SK Hynix has announced that it has developed the world's first highest density 128GB module based on 8Gb DDR4 using 20nm manufacturing process.


Thanks to Through Silicon Via (TSV) technology, the new module has double density compared to existing 64GB DDR4 modules. The developed 128GB DDR4 module works at 2133 Mbps and with 64-bit I/O it can process up to 16GB of data per second. As expected, it needs 1.2V in order to work at rated specs, which is significantly lower than 1.35V on current DDR3 modules.

"The development of the world's first 128 GB DDR4 module has its significance in opening ultrahigh density server market. The Company will further strengthen its competitiveness in premium DRAM sphere with the development of high density, ultrahigh speed and low power consuming products" said Senior Vice President Sung Joo Hong, the Head of DRAM Development.

Aimed to be used with the next-generation servers based on Intel Xeon E5 “Haswell” CPUs, the SK Hynix plans to start volume production of 64GB and 128GB modules in the first half of the next year.



Source: SKHynix.com.