Thermal paste below the IHS
In case you were wondering what is below the integrated heat-spreader (IHS) of the AMD A10-7700K Kaveri APU, you are definitely in luck, as we now have first pictures showing the 28nm APU 245 mm² die with 2.41 billion transistors.
Currently, AMD's Kaveri APU is the biggest APU silicon when compared to previous generations, including Richland, Trinity and Llano. In case you missed it earlier, it features two Steamroller CPU modules with two cores per module, 4MB of L2 cache, Graphics CoreNext-based GPU with 512 stream processors and dual-channel DDR3-2400 controller with hUMA as well as a PCI-Express 3.0 root complex.
Judging from the picture provided by Akiba PC Hotline, AMD decided to use thermal paste to transfer the heat from the die to the IHS and although we would certainly prefer to see solder, it was most likely a price saving option as Kaveri APUs are not your average high-end solution.
Source: Akiba-pc.watch.impress.co.jp, via Techpowerup.com.
Currently, AMD's Kaveri APU is the biggest APU silicon when compared to previous generations, including Richland, Trinity and Llano. In case you missed it earlier, it features two Steamroller CPU modules with two cores per module, 4MB of L2 cache, Graphics CoreNext-based GPU with 512 stream processors and dual-channel DDR3-2400 controller with hUMA as well as a PCI-Express 3.0 root complex.
Judging from the picture provided by Akiba PC Hotline, AMD decided to use thermal paste to transfer the heat from the die to the IHS and although we would certainly prefer to see solder, it was most likely a price saving option as Kaveri APUs are not your average high-end solution.
Source: Akiba-pc.watch.impress.co.jp, via Techpowerup.com.
News by Luca Rocchi and Marc Büchel - German Translation by Paul Görnhardt - Italian Translation by Francesco Daghini
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