We already have heard rumors about AMD licensing their Radeon integrated graphics chips to Intel for further use in their processors. Now new rumors are emerging that an unannounced Intel Kaby Lake-G series chip might feature such an AMD iGP in the shape of a multi chip module sitting on a single PCB.


Going back in history to when Intel launched their Clarkdale processors, or in other words the Core i5-600 series, they’ve last brought a multi chip module CPU to market. It now looks like Kaby Lake-G is going to use the same approach but they’ve refined it. The traditional implementation wouldn’t have offered enough throughput, which led to the development of the so called EMIB (Embedded Multi Die interconnect Bridge), which is more efficient. Furthermore HBM memory is going to be used to allow for fast memory access.

At the moment all the rumors suggest that these Kaby Lake-G processors would only be available for notebooks. It appears that there will be a rather low TDP, actually a TDP that is lower than what you get with a Kaby Lake–H (45W) processor. In addition the CPUs will also feature a package size of 58.5 x 32mm which is larger than the desktop Kaby Lake-S (37.5 x 37.5mm) and Kaby Lake-H series chips (42 x 28mm). The extra space might be used by a discrete GPU package.

Apparently Kaby Lake-G processors with an AMD iGP are going to compete with AMD’s APUs. In that regard it will be interesting to see what AMD is going to come up with in future or if they will show new APUs at all. To us it seems that AMD has scored a juicy deal with Intel using their IP in upcoming processors.







Source: Computerbase