While the newly leaked Intel roadmap shed a lot of details regarding Intel's upcoming 5th generation Core Broadwell as well as upcoming 6th generation Core Skylake chips, it also shed some details regarding Intel's new HEDT Broadwell-E platform.

As we already wrote, Intel's 14nm Broadwell chips, which are an optical shrink of Haswell, will be ready in Q2 this year and complemented by a full 14nm Skylake lineup in Q3 this year, Intel newest roadmap also revealed that Intel's new High-End Desktop (HEDT) Broadwell-E platform, which is meant to replace currently available Haswell-E chips, will be coming in Q1 2016.

According to the previous reports, Broadwell-E will have eight- and six-core options, have up to 20MB of Intel Smart cache, Intel Hyper-Threading support, up to 40 PCIe 3.0 lanes (2x16+1x8) and integrated quad-core DDR4-2000 memory support. Earlier reports also suggest that TDP of Intel's Broadwell-E Chips will be set at 140W, which is a bit surprising considering these will be based on 14nm manufacturing process.

Intel's Broadwell-E wil use the same X99 chipset as the current Intel Haswell-E lineup.





Source: PCOnline.com.cn.