There have been plenty of rumors regarding overheating issues with the Qualcomm Snapdragon 810 SoC but according to the latest report, it appears that TSMC has ironed out those issues and customers will be getting a perfect silicon in mid-March.


The recent rumors regarding overheating issues of the Qualcomm flagship Snapdragon 810 SoC, which allegedly led Samsung to only use its own Exynos SoC in the upcoming Galaxy S6, have been around for quite some time but according to the latest rumor coming from a Chinese analyst, citing sources within TSMC foundry, TSMC and Qualcomm managed to fix the issue and new batch of Snapdragon 810 SoC should ship out to customers in mid-March.

This also means that most of the new smartphones that will be announced at MWC 2015, scheduled to start in early March, will not be shipping before manufacturers get that fresh batch of Snapdragon 810 SoCs, or mid-March.

This also opens up a possibility that we might see the Galaxy S6 equipped with Snapdragon 810 SoC after all, but just after the Exynos 7 version.



Source: Phonearena.com.