Intel has now released some details regarding its next high-end desktop (HEDT) platform, codename Broadwell-E that will be using the existing LGA2011v3 socket and will be compatible with Intel's latest X99 Express chipset. Unfortunately, first piece of details also include information that Broadwell-E has been delayed to Q1 2016.


Originally scheduled to launch next year, it appears that Intel had to delay the launch of the Core i7 Broadwell-E to the first quarter of 2016. Based on 14nm manufacturing process, Intel Core i7 Broadwell-E HEDT chips will pack six to eight cores based on Broadwell architecture, 20MB of L3 cache and will be pin-compatible with Haswell-E chips, so you can expect similar set of features including quad-channel DDR4 memory controller.

As opposed to the Haswell-E lineup, entire Intel's Broadwell-E lineup might feature 40-lane PCIe interface, at least according to the released slide. The TDP of the Broadwell-E chips should be set at 140W.

According to released information, first qualification samples of Broadwell-E should be shipping in November 2015, while the actual retail ready products should come in the first quarter of 2016.



Source: via VR-Zone.com.