In addition to the new Macbook Air Haswell refresh and the iOS 7, Apple made quite a bang at Worldwide Developer Convention (WWDC) with the announcement of the completely redesigned Mac Pro with quite a impressive "can't innovate more my ass" statement from Phil Schiller, Senior VP of worldwide marketing at Apple.

The new Mac Pro will use a cylindrical shape with only a single cut-out that allows access to the back panel. Scheduled to ship later this year, the new Apple Mac Pro will pack quite a punch with new-generation Xeon CPU, dual GPUs, PCI-Express based storage, high-performance Thunderbolt 2 and bunch of other specs previously reserved for big box-like workstations.

The main culprit for such a design is Apple's impressive cooling solution with a single large fan that pulls air from bottom vent cooling the entire system via a unified thermal core which is basically a large triangular heatsink placed in the middle of the device and which comes in contact will all the major components.

Although Nvidia still stands as a dominant force in workstation graphics market, it looks like that AMD managed to score a big win as the new Mac Pro will rely on AMD's FirePro dual graphics cards for up to 7 TFLOPS of performance and 4K resolution support. The rest of the known specs include 802.11ac WiFi and Bluetooth 4.0 for connectivity, bunch of USB ports PCIe flash based storage and bunch of other features.

Unfortunately, Apple did not talk about the price considering that we will probably see a few SKUs but promised that it should be ready in Q3 and made in the US of A.









Source: Apple.com.