Intel's Skylake CPU successor, codename Kaby Lake, will also come with the new Intel 200-series chipset, which will get minor adjustments compared to current Intel 100-series Z170, H170 and Q170 chipsets.

According to leaked details, spotted by Computerbase.de, the new 200-series chipset will get higher number of High-Speed I/O lanes, increased from 26 to 30, thus increasing the number of PCI-Express lanes from 20 in the Skylake motherboards, to 24 with upcoming 200-series Kaby Lake motherboards. The new 200-series chipset will also bring support for DDR4-2400 memory, as opposed to DDR4-2133 officially supported on the Z170 Express chipset Skylake motherboards.

With the increased number of High-Speed I/O lanes comes higher number of USB 3.0 ports, up to ten, as well as six SATA 6Gbps ports. The new Intel 200-series chipsets will also get support for Intel's 3rd generation Thunderbolt, codename Alpine Ridge as well as support for M.2 PCIe x4 slot. There is also a support for Intel's Optane technology as well as 5K display and HEVC 10-bit and VP9 10-bit hardware decoding.

There are also minor details regarding the Kaby Lake CPUs, which should be available in dual and quad-core options in 35W, 65W and 95W TDP ratings.

Hopefully we will hear more about Intel Kaby Lake and 200-series chipset as we draw closer to the end of the year.





Source: Computerbase.de.