Intel is expected to release their new Haswell-E CPUs sometime in the next few months which will be a part of Intel's new HEDT (High-End Desktop) platform which targets enthusiasts and overclockers. Today, we have a first picture of the flagship Haswell-E CPU which was de-lidded and which shows that Intel is using soldered Thermal Interface Material (TIM).


Guys from the OCDrift.com somehow managed to get their hands on one of the Intel's upcoming Haswell-E CPUs, the flagship Core i7-5960X, and de-lid it, showing that Intel has decided to solder the die to the IHS with strong epoxy.

This is definitely a great news for overclockers as the IHS will allow much better heat conductivity which was the major reason behind low overclocking potential of the Core i7-3770K, 4770K and the Core i7-4790K CPUs. This info also suggest that Intel will use similar process on all upcoming Haswell-E chips which is definitely a good thing.

According to earlier rumors, the Core i7-5960X should feature eight cores, 16 threads and work at 3.0GHz base and 3.3GHz Turbo clocks.

According to earlier report, Intel's Haswell-E CPU and HEDT platform is expected in September 2014.



Source: OCDrift.com.