G.Skill to show next-gen memory at IDF 2013

New high performance DDR3 and DDR4 plans

G.Skill has announced that it will be a part of Intel's upcoming Intel Developer Forum scheduled for 10th of September in Moscone Convention Center, San Francisco, CA, where it will show its new high performance DDR3 memory as well as announce plans for future products, including DDR4 memory.


G.Skill will be a part of Intel's memory community at booth no. 165 where it will display maximum DDR3 frequency and capacity on Intel's new Core i7 processor family for socket LGA-2011 platform, show off its new high-performance quad-channel DDR3 memory as well as talk and announce plans regarding DDR4 memory.

Mark Yu, Technical Marketing at G.Skill, noted that the company is excited to show off its high-performance memory products and since it is their first time attending the IDF we are quite sure that we will see a lot of special things there.




Source: GSkill.com.

News by Luca Rocchi and Marc Büchel - German Translation by Paul Görnhardt - Italian Translation by Francesco Daghini


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