While we’ve already seen plenty of leaks and benchmarks based on AMD's upcoming Ryzen processors, some new details on the Intel X299 architecture have surfaced. According to rumors from Benchlife.info, Intel will launch their Core i7-7000 Skylake-X series during the next Gamescom in August.

The lineup will include four SKUs which are all going to be compatible with Intel’s X299 platform. Like the current lineup the upcoming one will features a 10 core, an 8 core, a 6 core and 4 core model. The first three CPUs will be based on the Skylake architecture while the last one, the quad-core, will use Kaby Lake as a basis. Due to different core counts and architectures there will also be different TDPs. Therefore all the Skylake-X based models will feature a TDP of 140W, while the Kaby Lake-X chips are supposed to have a TDP of 112W.

According to the latest rumors the upcoming Intel Core 7000 series will feature an new naming scheme. There won’t be any "X" version like the Core i7-6950X anymore, instead they’ll all be using the "K" suffix. That sound like Intel is going to get rid of their Extreme Edition line in favor of a more uniform naming convention.

Since the upcoming HEDT chips come with 2066 contact points, a new socket LGA2066 is required. This also means that Intel is going to launch a new chipset, which including the socket LGA2066. Skylake-X and Kaby Lake-X will also come with a memory interface, that clocks a little bit higher than the predecessor. By then the default clock speed will reach DDR4-2666.

Having a quick look at the specifications of the future Basin Falls chipset, it is supposed to offer 10 USB 3.0 ports, 8 USB 2.0 ports and an Intel LAN controller. Although the launch is expected during next Gamescom 2017 in August, Intel might showcase their Intel X299 products at Computex in June 2017 already. It looks like 2017 is shaping up to become a pretty interesting year for the hardware industry, with AMD Ryzen, new GPUs as well as new chips from Intel appearing.




Source: Wccftech