Top overclocker, Dancop, has published a new guide which shows how to prepare your ROG Maximus VIII series motherboard for extreme overclocking and sub-zero temperatures.

When it comes to preparing a Z170 based setup for extreme overclocking, preparation is critical. First of all you need to "delid" your CPU. After that you can apply new thermal compound. You need to do this since the stock thermal compound, or as Intel calls it TIM (Thermal Interface Material), is going to crack at extremely low temperatures. The negative influence of these cracks on heat conductivity limits overclockability. In his guide Dancop is showing in detail how to delid your CPU and then apply new thermal compound perfectly.

In order to bypass this problem, extreme overclockers mostly de-lid their CPUs as well as prepare their motherboards for LN2 overclocking scenarios.

The new guide from Dancop talks about preparation, BIOS settings and handling on some of the most popular ASUS ROG Maximus VIII motherboards, Extreme, Hero and Gene.

The newly published guide from Dancop shows a lot of details on how to prepare for LN2 overclocking session and in case you are interested, you can check out the full guide either over at ASUS' ROG site or HWBOT.org forum via link below.




Source: HWBOT Forum.