SK Hynix has announced that it has started the full-scale mass production of 16nm 64Gb MLC (Multi-Level Cell) NAND flash chips. This is actually Hynix SK's second version that is more cost competitive due to its smaller chip size.

Although it has already been mass producing the first version of 16nm NAND flash chips since June, SK Hynix has now started the mass production of the second version which is more cost competitive due to its smaller chip size. The company also announced that it has developed 128Gb 16nm chips, which is the highest density in a single MLC chip on the market. According to Hynix SK, these chips are scheduled for mass production from the beginning of the next year.

"After the Company developed and started to mass produce the industry's thinnest 16 nm product then now prepared high density NAND Flash product portfolio thanks to the development of 16 nm 128 Gb MLC", said senior vice president Jin Woong Kim, the Head of Flash Tech Development. "The Company plans to actively respond to our customers' demands with the NAND Flash products which have high reliability and endurance."

Hynix SK plans to further strengthen its competitiveness in NAND flash market while also work on accelerating the development of TLC (Triple-Level Cell) and 3D NAND flash chips.



Source: SKHynix.com.