Mullins and Beema APUs
AMD has released its newest 2014 mobile APU roadmap during the APU13 Developer Conference that has some details regarding upcoming new APUs, codenamed "Mullins" and "Beema", which should no only raise the performance bar in fanless tablets, 2-in-1 systems and ultrathin notebooks but also deliver more than 2x the performance-per-watt when compared to the previous generation.
Coming in 2014, the "Mullins" and the "Beema" mobile APUs are the successors of Temash and Kabini APUs. Aimed at mainstream and low-power essential markets, the Beema APUs are made on 28nm manufacturing process and feature 2-4 Puma CPU cores paired up with GCN-based GPU. It will features AMD Security Processor and have 10-25W TDP range. According to a slide from AMD, Beema should bring 2x more performance in both 3DMark 11, or GPU power, as well as the PCMark 8, or CPU and general performance.
The "Mullins" APU is the successor of the Temash and will tend to the ultra-low power market segment. Also based on a 28nm manufacturing process, this SoC also features 2-4 Puma CPU cores, Graphics Core Next-based GPU, AMD Security processor and around 2W SDP, or Scenario Design Power. The equivalent should be around 4.5W TDP, which is quite lower compared to Temash 3-4W SDP and 4 to 9W TDP. Of course, it gets better considering that the Mullins should bring over 2x better performance in both GPU and CPU department, bringing some impressive tablets and 2-in-1s.
As you could see from the list of specifications, both wil bring the so called AMD Security Processor with ARM TrustZone, or simply, ARM Cortex-A5 processor that will be integrated in the SoC. Both will also bring AMD DockPort technology support, Microsoft 8.1 optimizations for performance, AMD wireless display and more, Microsoft InstantGo that should bring faster wake times and much more.
AMD is certainly doing a lot to get into the tablet, 2-in-1 and ultrathin market and although Temash APU already sounds pretty good on paper we are still waiting for some big design wins. Of course, both the Mullins and the Beema APUs should bring much better acceptance from major tablet, notebook and other manufacturers.
Source: Computerbase.de.
Coming in 2014, the "Mullins" and the "Beema" mobile APUs are the successors of Temash and Kabini APUs. Aimed at mainstream and low-power essential markets, the Beema APUs are made on 28nm manufacturing process and feature 2-4 Puma CPU cores paired up with GCN-based GPU. It will features AMD Security Processor and have 10-25W TDP range. According to a slide from AMD, Beema should bring 2x more performance in both 3DMark 11, or GPU power, as well as the PCMark 8, or CPU and general performance.
The "Mullins" APU is the successor of the Temash and will tend to the ultra-low power market segment. Also based on a 28nm manufacturing process, this SoC also features 2-4 Puma CPU cores, Graphics Core Next-based GPU, AMD Security processor and around 2W SDP, or Scenario Design Power. The equivalent should be around 4.5W TDP, which is quite lower compared to Temash 3-4W SDP and 4 to 9W TDP. Of course, it gets better considering that the Mullins should bring over 2x better performance in both GPU and CPU department, bringing some impressive tablets and 2-in-1s.
As you could see from the list of specifications, both wil bring the so called AMD Security Processor with ARM TrustZone, or simply, ARM Cortex-A5 processor that will be integrated in the SoC. Both will also bring AMD DockPort technology support, Microsoft 8.1 optimizations for performance, AMD wireless display and more, Microsoft InstantGo that should bring faster wake times and much more.
AMD is certainly doing a lot to get into the tablet, 2-in-1 and ultrathin market and although Temash APU already sounds pretty good on paper we are still waiting for some big design wins. Of course, both the Mullins and the Beema APUs should bring much better acceptance from major tablet, notebook and other manufacturers.
Source: Computerbase.de.
News by Luca Rocchi and Marc Büchel - German Translation by Paul Görnhardt - Italian Translation by Francesco Daghini
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