According to the latest report, SK Hynix should start mass production of the 4GB 2nd generation High Bandwidth Memory (HMB2) in Q3 2016, with 8GB dies entering mass production just a quarter later, in Q4 2016.

With both Nvidia and AMD gunning to use the 2nd generation High Bandwidth Memory (HBM2) on their future high-end graphics, Golem.de is reporting that SK Hynix is gearing up to start mass production of both 4GB and 8GB HBM2 chips later this year, in third and fourth quarters.

With more information regarding AMD's and Nvidia's next-generation Polaris and Pascal GPU architectures expected at GDC next week and Nvidia's GTC event in April, we will get a lot of information regarding the future of the GPU market.

With SK Hynix gearing up for mass production of new 4GB HBM2 chip in Q3 2016, this suggest that next-generation high-end graphics cards could be expected in June/July.

The 8GB HBM2 chips, expected to hit mass production in Q4 2016, will most likely end up in professional graphics cards with 32GB of HBM2 on a single graphics card.

In case you missed it earlier, the new 2nd generation High Bandwidth Memory (HBM2) will use vertically stacked 8Gb dies and offer 256Gbps of bandwidth, which is twice the bandwidth currently offered by the first generation High Bandwidth Memory (HBM1).

With two such packages on a single interposer will add 8GB of VRAM with 512GB/s of bandwidth while four will hit 16GB of VRAM with 1TB/s of bandwidth. In addition to the higher performance as well as higher density, the HBM2 also brings lower power, or around 40 percent accordign to SK Hynix.

Hopefully, we will get more specific details at the upcoming GDC and GTC shows in the coming months.





Source: via Wccftech.com.