According to the latest leak coming from two AMD staff LinkedIn profiles, it appears that the upcoming Fiji GPU based Radeon R9 380X will indeed feature High-Bandwidth Memory (HBM).

Although the source of the leak is rather uncommon, it is actually much better confirmation compared to latest rumors. Spotted by 3D Center, the two LinkedIn profiles not only confirm that the R9 380X will feature High-Bandwidth Memory (HBM) but also be a 300W TDP part.

The first LinkedIn profile comes from Ilana Shternshain, an ASIC Physical Design Engineer, which was behind the Playstation 4 SoC, Radeon R9 290X as well as the new Radeon R9 390X graphics card, which he describes as the "largest in 'King of the hill' line of products," and pretty much confirms that AMD is at least considering the R9 380X naming scheme for the upcoming Fiji GPU based high-end graphics card.

The second LinkedIn profile, from AMD's System Architect Manager Linglan Zhang, does not mention the Radeon R9 380X, but suggest that he was involved in development of "the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer."

While the R9 380X name might not be carved in stone, these are still the best evidence regarding first specifications and details of AMD's Fiji GPU based upcoming flagship graphics card. According to earlier rumors, that same graphics card is scheduled to appear early this year, so hopefully we will see more leaks as we draw closer to the launch date.



Source: Techreport.com.