According to the latest rumor AMD's upcoming Carrizo APU will be still based on the 28nm manufacturing process but also use 20nm stacked DRAM technology.

The unconfirmed leak comes from the Italian site Bitsandchips.it and suggest that AMD's upcoming Carrizo APU will still stick to 28nm manufacturing process but also used Stacked DRAM HBM (High Bandwidth Memory) technology, something that AMD has been working on with Hynix for quite some time.

APU's generally benefit from better memory and if the AMD Carrizo APU ends up with support for HBM we could expect some rather decent performance improvements when compared to Kaveri APUs, despite the fact that both will be based on the same 28nm manufacturing process. Since the Carrizo APU will be implementing HSA, it should be much better in compute and gaming scenarios.

The aforementioned Stacked DRAM HBM can provide memory bandwidth of 128-256GB/s, which is definitely better than earlier rumored DDR4 support. The Carrizo APU die is rumored to be smaller than Kaveri but with Stacked DRAM and 28nm manufacturing process, we are not sure how that will happen.

AMD's Carrizo APU is expected to use the same FM2+ socket as well as keep the 64W TDP and if the Stacked DRAM HBM rumor turns out to be true, Carrizo APU will definitely have an interesting place on the market.



Source: Bitsandchips.it, via Wccftech.com.