Closer Look

In a typical Kingston fashion, the packaging consists of a black tray to lock the modules in place and a transparent cover for a potential buyer to see through.


Appearance of the modules is definitely not innovative; it is a well-known mix of standard green PCB and heatspreaders finished in Kingston’s trademark blue. One could criticize Kingston for their lack of imagination, but why spend extra R&D money thus making products more expensive when T1 heatspreaders already provide near maximum possible surface area and many people do not care about looks anyway.





Each of the modules is flashed with an SPD that contains information about maker, model and date of production. SPD also serves as an aid for setting timings and subtimings. For that purpose, it features a quartet of JEDEC profiles accompanied with a pair of XMP, both of which are being misread by CPU-Z. In reality, the first profile stands for DDR3-2400 at 11-13-13-30, which, we reckon, is the actual spec of this memory and the second – for a more reasonable DDR3-2133 at 11-12-11-30.


Another aspect where we didn’t notice any changes was the thermal adhesive responsible for heat transfer between ICs and heatsinks. Similar to HyperX modules of the past, on our T1 it was loose enough to attempt heatspreader removal without any additional precautions.




It turns out that our modules are based on Hynix’s 2Gb CFR-series ICs. Such choice is not bad given the memory specification but, to be honest, on a flagship product we expected to see something better like BFR or Samsung revision D.

Page 1 - Introduction	Page 4 - Results
Page 2 - Closer Look	Page 5 - Conclusion
Page 3 - Photo Gallery

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