Layout

As we mentioned in the introduction the MSI Z270 XPower Titanium Edition motherboard comes with a great looking design. The PCB has a silverish/greyish finish and the heatsinks are silver and black. Apart from that there are black slots and sockets as well as the metal reinforcements on the PCIe slots. Overall this board looks very different from anything what you can buy these days. On the PCH you'll also find the great looking MSI dragon. The cooling blocks themselves have been shaped with a lot of attention to detail. The layout has been well thought and there are plenty of useful features, like for example a header to attach external USB 3.1 ports, SATA 6Gbps Ports, three M.2 Gen 3 x4 slots, overclocking features and more.

MSI equipped the Z270 XPower Titanium Edition motherboard with a 10+4-phase digital power design regarding CPU and iGPU. The PWM controller chips is an IR35201 from International Rectifier and it's working in 6+2-phase mode, while 5+2 phases are handed over to phase doublers. In a further step there are IR3555A power stages, which have been rated with 60A. Apart from that there are "Ti" branded inductors and a whole bunch of tantalum capacitors taking care of the output filtering stage. Overall this is a very high-end power design and certainly one of the most compelling we'll come across in the case of Z270.

This board has been equipped with a total of two DIMM-slots. Officially supported is everything up to DDR4 4133 (O.C.). There is engough space between the DIMM-slots and the CPU socket which means that you wont encounter compatibility problems with big coolers even when you choose to install RAM with big heatspreaders. Also supported are Xtreme Memory Profiles (XMP) in version 2.0.

The PCH as well as the current converters are being held at reasonable temperatures via passive heatsinks. On top of the current converters there are two aluminum heatsinks, which are connected with a nickel plated, copper 6mm heatpipe. The PCH heatsink - also milled from an aluminum block and it has not been been integrated into the heatpipe loop. The heatsinks have been very well made and they are perfetcly attached to the board to provide enough pressure on the components ensuring an efficient heat transfer.

Page 1 - Introduction	Page 14 - SiSoft Sandra 2
Page 2 - Specs and Delivery	Page 15 - UC Bench
Page 3 - Features	Page 16 - Super Pi 1M / 32M
Page 4 - Layout	Page 17 - wPrime 1024M Multi Core
Page 5 - Connectors and I/O	Page 18 - Cinebench
Page 6 - BIOS	Page 19 - Tomb Raider
Page 7 - Test setup	Page 20 - Metro Last Light
Page 8 - Preview / Gallery	Page 21 - Sleeping Dogs
Page 9 - 3D Mark	Page 22 - Power Consumption
Page 10 - 3D Mark 11	Page 23 - Performance Rating
Page 11 - 3D Mark Vantage	Page 24 - Price Comparison
Page 12 - PC Mark 8	Page 25 - Conclusion
Page 13 - SiSoft Sandra 1