Intel releases B365 chipset

B360 produced with 22nm process

A couple of months ago, Intel released the H310C chipset which was a downgrade of the existing 14nm H310 chipset back to the 22nm process node. Since Intel is facing several issues with 14nm process, the chipmaker has launched the new B365 chipset. It's basically the B360 chipset produced with the 22nm manufacturing process and the Kaby Lake Platform Controller Hub (PCH).



The latest B365 chipset isn't based on Coffee Lake PCH but employs Kaby Lake PCH instead. As a result, there are a few differences between these two chipsets. For example the max number of PCI Express lanes and USB ports have been improved. While the Intel B360 sports 12 PCIe lanes and 12 USB ports, the upcoming B365 chipset features 20 PCIe lanes and 14 USB ports. Furthermore it brings RAID configurations to the table.

Nevertheless, the B360 chipset have pros in other departments. The B360 chipset comes with support for integrated wireless networking and USB 3.1, unlike the B365 chipset. Since both chipsets belong to the lower-end, we expect that the upcoming B365 motherboards should perform equally as existing B360 motherboards. With this small update, Intel might free up resources for 14nm production.




Source: Intel


News by Luca Rocchi and Marc Büchel - German Translation by Marc Büchel - Italian Translation by Francesco Daghini


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Intel releases B365 chipset - Intel - News - ocaholic