Expected in August
A few days ago according to a report from CPCHardware, Intel is currently planning to release two new Core i7 and Core i5 processors. Thanks to an update from our friends over at PCGH, both CPUs might belong to the upcoming Kaby Lake-X series. On top of that Intel will also launch their Skylake-X series CPUs during this years Gamescom in August.
So far it looks like the current Kaby Lake lineup from Intel is not going to change and the Core i7-7700K will remain the flagship regarding Kaby Lake. According to PCGH the two chips people are talking about these days, namely the Core i7-7740K and the i5-7640K could both belong to the Kaby Lake-X lineup. The chips that belong to this lineup will be launched in August during Gamescom. Both these chips will Feature the upcoming socket LGA2066 and they will basically be the bridge between Intel’s performance desktop and high-end desktop offerings.
All Skylake-X based models will feature a TDP of 140W, while the Kaby Lake-X chips are supposed to have a TDP of 112W. The Core i7-7740K and the Core i5-7640K might be both based on same Kaby Lake-S-Die but with a disabled iGPU and higher TDP in favor of slightly increased clock speeds. Compared to the Core i7-7700K we will find support for quad channel memory which will also add a little bit to the overall performance level. Since the upcoming HEDT chips come with 2066 contact points, a new socket LGA2066 is required. This also means that Intel is going to launch a new chipset, which including this socket LGA2066.
However these rumors are still not confirmed. First of all, according to Benchlife.info, the new Kaby Lake-X series should include only Core i7 series and not also a Core i5 CPU. On top of that it’s still not clear whether Intel will solder the heat spreader directly to the Die or they will use their “Thermal Interface Material” in the case of all Kaby Lake based chips. Especially since the current Kaby Lake series chips already suffer from overheating issues when you overclock them just slightly, we would really like to see heat spreaders that are soldered to the Die. If that is not going to be the case the temperature headroom will be very small with Kaby Lake-X.
Source: PCgameshardware
So far it looks like the current Kaby Lake lineup from Intel is not going to change and the Core i7-7700K will remain the flagship regarding Kaby Lake. According to PCGH the two chips people are talking about these days, namely the Core i7-7740K and the i5-7640K could both belong to the Kaby Lake-X lineup. The chips that belong to this lineup will be launched in August during Gamescom. Both these chips will Feature the upcoming socket LGA2066 and they will basically be the bridge between Intel’s performance desktop and high-end desktop offerings.
All Skylake-X based models will feature a TDP of 140W, while the Kaby Lake-X chips are supposed to have a TDP of 112W. The Core i7-7740K and the Core i5-7640K might be both based on same Kaby Lake-S-Die but with a disabled iGPU and higher TDP in favor of slightly increased clock speeds. Compared to the Core i7-7700K we will find support for quad channel memory which will also add a little bit to the overall performance level. Since the upcoming HEDT chips come with 2066 contact points, a new socket LGA2066 is required. This also means that Intel is going to launch a new chipset, which including this socket LGA2066.
However these rumors are still not confirmed. First of all, according to Benchlife.info, the new Kaby Lake-X series should include only Core i7 series and not also a Core i5 CPU. On top of that it’s still not clear whether Intel will solder the heat spreader directly to the Die or they will use their “Thermal Interface Material” in the case of all Kaby Lake based chips. Especially since the current Kaby Lake series chips already suffer from overheating issues when you overclock them just slightly, we would really like to see heat spreaders that are soldered to the Die. If that is not going to be the case the temperature headroom will be very small with Kaby Lake-X.
Source: PCgameshardware
News by Luca Rocchi and Marc Büchel - German Translation by Paul Görnhardt - Italian Translation by Francesco Daghini
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