During its third quarter financial call, AMD's CEO, Lisa Su, confirmed that the company will update its either AIB and OEM graphics card lineup in the coming quarters. AMD's 14/16nm FinFET Arctic Islands GPUs should be coming in 2016.
During the last financial call, AMD CEO, Lisa Su, has stated that the company is still focused on graphics innovation and has made a good progress when it comes to graphics card market in Q3 2015. She also added that the company has plans to continue this growth over a number of quarters.
In case you missed it, AMD has recently formed a new business unit that will be focused solely on graphics, the Radeon Technologies Group and has expanded their product portfolio with several new APUs and GPUs. The company is also focused on both traditional graphics markets as well as emerging and immersive computing markets like virtual and augmented reality.
Answering a question from an analyst, Joe Moore, Lisa Su said that while the recently launched Radeon Fury graphics cards had issues with supply constraints which were and are solved in the fourth quarter.
She also added that while the graphics portfolio is quite broad, we can expect to see the full update of the entire portfolio over the coming quarters. She noted that the company is focused on delivering next-generation GPUs in 2016 that should improve performance per watt by two times, compared to current offering, both thanks to design architectural enhancements as well as a new advanced FinFET manufacturing process.
Lisa Su also confirmed that the company has taped out multiple products using FinFET manufacturing process across both foundry partners, TSMC with 16nm FinFET process and GlobalFoundries with 14nm FinFET process.
AMD has not been doing that good recently and it certainly needs a good GPU design to push its graphics share a bit higher and the upcoming Arctic Islands, which will find its way into next-generation mobile and desktop graphics cards, APUs and semi-custom chips, sounds like the right chip, especially if AMD manage to use 2nd generation High Bandwidth Memory (HBM2) and bring some impressive improvements with its 3rd generation GCN architecture.
Source:
Wccftech.com.