According to Benchlife, Intel is going to launch their upcoming X299 HEDT as well as the Coffee Lake platform during the next months. In other words it could be possible that we might see the first samples related to X299 in June.


What’s really interesting to see with this latest batch of rumors is that there is more information on Coffee Lake and the Intel 300 series chipset, which will succeed the current 200 series. The upcoming Intel 300 series chipset will still use the current socket LGA 1151. On top of that it looks like Intel could bring hexa core CPUs to the mainstream market, which would make Coffee Lake even more interesting.

As we’ve already reported several times Intel might not only launch the Coffee Lake-S processors but also Skylake-X and Kaby Lake-X, whereas the latter are based on socket LGA 2066. Regarding those chips Intel is planning a lineup, that is similar to the existing Broadwell-E models, therefore there is supposed to be a 10 core, an 8 core, a 6 core and 4 core model. The first three CPUs will be based on the Skylake architecture while the last one, the quad-core, will use Kaby Lake as a basis. Due to different core counts and architectures there will also be different TDPs. Therefore all the Skylake-X based models will feature a TDP of 140W, while the Kaby Lake-X chips are supposed to have a TDP of 112W.

Meanwhile there is still some mystery around the Kaby Lake-X CPUs since they will feature quad-core designs with dual-channel support and up to 16 PCI Express lanes. It looks like Intel is going to repackage the mainstream Kaby Lake into the new socket. On another note Benchlife has mentioned that Intel might integrate USB 3.1 Gen 2 (10Gbps) and Gigabit Wi-Fi into the 300 series chipset, which would certainly be a very nice addition.




Source: Guru3D