According to the latest report, future Intel chipset could integrate both native WLAN and USB 3.1.

The upcoming Intel 200-series chipset motherboard will not bring many feature updates and as the 7th generation Core Kaby Lake CPUs will be able to work on Intel 100-series chipset motherboard with BIOS updates this won't be an interesting time in the motherboard market.

Luckily, it appears that the future 300-series chips might be a bit more interesting as, according to a report from Digitimes.com, Intel might be bringing new integrated features.

According to the report, Intel might be looking to integrate WLAN as well as native 10Gbps USB 3.1 (gen 2.0) controllers in its future chipset.

While this sounds great, it could have a big impact on third-party WLAN and USB 3.1 controller manufacturers like Realtek and ASMedia.



Source: via Techpowerup.com.