A recent leak has provided more details regarding Intel's new X299 chipset that will be a part of the next HEDT (High-End Desktop Platform) for Skylake-X and Kaby Lake-X CPUs.

Meant to replaced the ageing X99 chipset platform which was launched back in 2014 and provided support for Intel's Haswell-E and Broadwell-E CPUs, the new X299 chipset platform will bring new socket with 2066 pins, which will probably lead to the new LGA 2066 socket name.

The new socket will probably support at least three generations of CPUs, including Skylake, Kaby Lake and probably Cannonlake CPUs, while the new socket could be coming with future Ice Lake architecture.

The first Skylake-X HEDT CPUs are expected in the second half of 2017 and should be available in the same core configuration as the recently launched Broadwell-E CPUs, including 10-, 8- and 6-core SKUs with TDP ranging to 140W.

The new platform, which should be known as the Basin Falls-X platform will bring quad-channel memory support on Skylake-X and dual-channel memory support on Kaby Lake-X CPUs, with up to 24 PCIe Gen 3.0 lanes, 10 USB 3.0, 8 USB 2.0 and Intel Ethernet with the Kaby Lake-X PCH.

More information regarding Skylake-X and Kaby Lake-X chips will probably show up during next year and as we draw closer to the second half of it while Intel is currently gearing up to launch its Kaby Lake-S CPUs at CES 2017 in January 2017.



Source: Wccftech.com.