To broaden sales in Asia
Intel has signed a strategic agreement with Rockchip which should expand and strengthen the the sale network in Asia by getting Rockchip to sell Intel branded SoCs, namely the SoFIA SoCs scheduled to ship next year.
The new agreement will allow these two companies to introduce Intel-branded mobile SoC platform which will be based on an Intel Atom CPU core integrated with Intel's 3G modem. To be available in the first half of the next year, the new quad-core SoFIA 3G part will allow Intel to expand its SoFIA family of integrated mobile SoC platforms aimed at entry and value Android mobile device market.
"The strategic agreement with Rockchip is an example of Intel's commitment to take pragmatic and different approaches to grow our presence in the global mobile market by more quickly delivering a broader portfolio of Intel architecture and communications technology solutions," said Brian Krzanich, Intel CEO. "We are excited to work with Rockchip. With today's announcement we've added yet another derivative to the Intel SoFIA family, and we expect to have them all in market before the middle of 2015. We are moving with velocity to grow Intel's offerings for the growing global tablet market."
"We are always looking for innovative ways to differentiate our product portfolio, and the first-of-its-kind collaboration with Intel helps us do this," said Min Li, Rockchip CEO. "The combination of Intel's leading architecture and modem technology with our leading mobile design capability brings greater choice to the growing global market for mobile devices in the entry and value segments."
With the latest announcement, Intel's SoFIA family of products will now include three different models, the dual-core 3G version, expected to ship in the fourth quarter of this year, the quad-core 3G version for the first half of the next year and the LTE version of the same platform, also expected around the same time.
Although the price has not been disclosed, Intel did note that this part will be price competitive. Both companies will sell the new part to OEMs and ODMs thus significantly expanding the sale base, especially in Asia.
Source: Intel.com.
The new agreement will allow these two companies to introduce Intel-branded mobile SoC platform which will be based on an Intel Atom CPU core integrated with Intel's 3G modem. To be available in the first half of the next year, the new quad-core SoFIA 3G part will allow Intel to expand its SoFIA family of integrated mobile SoC platforms aimed at entry and value Android mobile device market.
"The strategic agreement with Rockchip is an example of Intel's commitment to take pragmatic and different approaches to grow our presence in the global mobile market by more quickly delivering a broader portfolio of Intel architecture and communications technology solutions," said Brian Krzanich, Intel CEO. "We are excited to work with Rockchip. With today's announcement we've added yet another derivative to the Intel SoFIA family, and we expect to have them all in market before the middle of 2015. We are moving with velocity to grow Intel's offerings for the growing global tablet market."
"We are always looking for innovative ways to differentiate our product portfolio, and the first-of-its-kind collaboration with Intel helps us do this," said Min Li, Rockchip CEO. "The combination of Intel's leading architecture and modem technology with our leading mobile design capability brings greater choice to the growing global market for mobile devices in the entry and value segments."
With the latest announcement, Intel's SoFIA family of products will now include three different models, the dual-core 3G version, expected to ship in the fourth quarter of this year, the quad-core 3G version for the first half of the next year and the LTE version of the same platform, also expected around the same time.
Although the price has not been disclosed, Intel did note that this part will be price competitive. Both companies will sell the new part to OEMs and ODMs thus significantly expanding the sale base, especially in Asia.
Source: Intel.com.
News by Luca Rocchi and Marc Büchel - German Translation by Paul Görnhardt - Italian Translation by Francesco Daghini
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