Meanwhile it's clear that SSDs are much faster than standard hard drive and the only bastion that has not been taken by the SSDs now is capacity. These days semiconductor companies are working on finding new ways to improve data densities and other tricks.

Basically raw capacity can be increased in two ways: semiconductor companies work on further refined manufacturing processes to provide NAND flash cell, which are even smaller then their predecessors and thereofre more cells fit on the same space. A second approach would be to cram more NAND flash chips into a case of a given size.

These days you can find a report over at VR-Zone, showing plans from Intel where it seems like they want to do exactly this. Based on a 3.5 inch case, Intel wants to put as many NAND flash chips into that space. Maximizing the amount of chips als means, that TDP is going up and therefore additional cooling is needed. To solve this issue, Intel wants to use the 3.5 inch case as a headsink and therefore they want to be able to remove no less than 25 Watt of dissipation power.

A closer look at the picutres below shows, that Intel is working on an SSD case, that is going to work as a cooler. VR-Zone is also expecting, that Intel will present first prototypes during IDF in Q4 2014.






Source: VR-Zone