Intel's Purley platform will be based on the new LGA3647 socket and offer some impressive features as well as bring support for Intel's upcoming Xeon EP/EN and Knights Landing chips.

While these will be only available for the server market, with consumer Skylake-X only coming later with socket LGA2066 and up to 10-cores, it is interesting to see the Purley platform in pictures.

In case you missed it earlier, the Purley platform will bring some new features including support for 6-channel memory but the most impressive thing is the sheer size of the socket and the processor package. Compared to Broadwell-EP and Broadwell-DE, the LGA3647 processor is just huge.

The new LGA3467 socket was pictured by Servethehome.com on Gigabyte dual-socket motherboard and it does not feature a standard dual-latch mounting system but rather feature a new mechanism that secures the CPU to the heatsink which is then guided into place by socket pins. The pictured cooler is simply a massive heatsink that can dissipate more than 200W of heat.

The Purley platform will support 2S, 4S and 8S chips from Skylake-EP and Skylake-EN lineup and come with Storm Lake Gen 1 architecture which is Intel's next-gen Omni-Path interconnect, offering up to 100GB/s interconnect speed with 56% lower latency.

The size of Knights Landing chip and new LGA3647 socket is just insane but things get big when you are packing a lot of performance in chip and these server parts will be packing quite a lot of punch.









Source: via Wccftech.com.