Samsung might be making Qualcomm's Snapdragon 830

On its 10nm manufacturing process

According to the latest report, it appears that Samsung will be making Qualcomm's next-generation Snapdragon 830 SoC on its 10nm manufacturing process.

According to Korean ET News site, Samsung might have scored a new contract in making the new Qualcomm Snapdragon 830 SoC on its 10nm manufacturing process. This won't be the first deal between Samsung and Qualcomm as the company is currently manufacturing the Snapdragon 820 SoC on its 13nm LPP FinFET manufacturing process.

The same source also suggest that the Samsung Galaxy S8 could end up with that same Snapdragon 830 SoC, which could also be a part of the deal between Samsung and Qualcomm.

Both Samsung's own Exynos 8895 SoC and the Qualcomm's new flagship 830 SoC are expected to be made on 10nm manufacturing process. The rumor also states that both Qualcomm and Samsung are currently working on a FoPLP (Fan-out Panel Level Package) technology, which will eliminate the need for a PCB in the package substrate used on these next-gen SoCs.

Earlier rumors suggested that Samsung is getting good performance from its Exynos 8895 SoC on 10nm manufacturing process, pushing up to 4GHz on custom Mongoose CPU core and up to 2.7GHz on Cortex-A53 cores so it will be interesting to see how well will Qualcomm's Kyro CPU cores do on that same process.



Source: Androidcentral.com.

News by Luca Rocchi and Marc Büchel - German Translation by Paul Görnhardt - Italian Translation by Francesco Daghini


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