ADATA Technology has announced its newest addition to the XPG line of overclocking memory modules and kits, the ADATA XPG V3 DDR3 kits which will be available in version reaching 3100MHz. Aimed to be used with Intel's fourth and fifth generation Core CPUs and the latest Z97 Express chipset platform, the new XPG V3 DDR3 memory will offer some impressive performance and features.

Pushing the level of DDR3 memory once again, the ADATA XPG V3 DDR3 overclocking memory will be available in versions ranging from DDR3-1600 and up to DDR3-3100MHz, offering transfer bandwidth of up 24.8GB/s. The new XPG V3 DDR3 lineup will be available 8GB (2x4GB) and 16GB (2x8GB) kits with CL9, CL10, CL11 and CL12 latencies, depending on the frequency. The new ADATA XPG V3 DDR3 modules are based on a high-quality 8-layer PCB with 2oz copper for higher efficiency and improved cooling performance and support Intel XMP 1.3 profiles and dual-channel modes.

The recognizable heatspreader design uses Thermal Conductive Technology (TCT) which enables every chip to be in contact with the heatsinks directly. The heatspreader can also be detached and replaced with the pair of fins which are included in the bundle. This is also great for overclockers which tend to use LN2 pots for memory cooling rather than sticking to factory heatspreaders.

Unfortunately, ADATA did not reveal any details regarding the price or the availability date for the new ADATA XPG V3 DDR3 modules or kits.







Source: ADATA.com.