In a typical Kingston fashion, the memory comes in a simple plastic tray, which ,we think, provides sufficent protection.
Another familiar thing is the appearance of the HyperX T1 modules, which have been around since 2008. Seriously, why would you want to change the heatspreader design if what we have on our table offers maximum possible surface area for modules of such height?
Those familiar with Kingston's SPD of the older days will immediately notice that part number information has changed from an internal code which you had to google to something you can easily understand. Apart from this, everything else is very normal – you have four JEDEC profiles, one XMP with specs and another (misread) XMP with sensible settings of DDR3-3200.
Removing the T1 series heatspreaders is just as easy as it has been in the past, you don't even need to apply additional heating. With them out of the way, we discovered that our modules are based on Hynix's
brand new 4Gb ICs coded MFR rather than Samsung we saw on G.Skill's TridentX.
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